Winbond Electronics is expected to complete development of low- to medium-density NOR flash using 90nm processing technology at its 12-inch fab in the first or second quarter of 2008 with mass-production of memory chips to begin in the third quarter, according to company vice chairman and deputy chief executive officer (CEO) Ching-Chu Chang.
From: www.digitimes.com
Winbond to start mass-producing 90nm NOR flash in 3Q08
Posted by Ruslan Abuzant at 1:53 AM
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